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A Review of Two Phase Forced Cooling in Three Dimensional Stacked Electronics: Technology Integration
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Threedimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking ...
Three Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports on novel thermal testbeds with embedded micropinfin heat sinks that were designed and microfabricated in silicon. Two micropinfin arrays were presented, each with a nominal pin height of 200 خ¼m and ...
Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two ...